The 832HD 1:1 Epoxy Potting and Encapsulating Compound is a two-part, economical, flowable, electronic-grade epoxy that provides excellent physical, chemical, and electrical protection.
The 9300 One-Part Epoxy General Purpose Adhesive, Low Tg is a heat cured, electrically and thermally insulating, semi-thixotropic glue for low stress bonding of SMD’s and fiber optic components.
The 9310 One-Part Epoxy General Purpose Adhesive, High Tg is a heat cured, electrically and thermally insulating, thixotropic glue for bonding SMD’s to PCB’s.
